- Overview
- Product Description
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- FAQ
Basic Info.
Product Description
Microelectronic package, fiber laser diode cover
Product Application: Defense, Aviation, Aerospace, Industrial, Medical electronics
Advantages
Custom design for the microelectronic package
Variety material suitable for many working environments
Good quality and plating makes the packages suitable for high temperature
Main performance parameters:
Housing material: Kovar, Tungsten Copper, OFHC, Stainless steel
Lead material: KOVAR
Glass: 7052 or equivalent
Applicable technology for sealing: parallel sealing welding, laser welding, vacuum welding
The electric voltage: 1000 v (50 HZ)
Resistance to pressure: 40 mpa, 1 h
Insulation resistance: >20MΩ at 500VDC
Nickel layer thickness: 3~12μm
Thickness of gold layer: 0.3~3.8μm
Leakage: ≤ 1 x10-8 atm cc/sec
Salt spray test: 5%, 24-h moisture resistance, mold resistance performance in accordance with GIB 598A-96 standard
Q: Are you manufacturer or trading company?
A: We are manufacturer which focuses hermetic sealed package since 1976.
A: 1500000pcs ~ 2200000pcs per year .
Q: What is the lead time of your product?
A: Stocks are available for some products. 20~30working days for custom parts
Q: Do you provide customized products?
A: Yes. We provide OEM and ODM service.